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Semiconductor and IC Packaging Testing

Our IC packaging pipeline -- categorized into WBGA, LGA, FBGA-SSD, and SiP-eMCP and USB packaging -- will manufacture a variety of products including DRAM, eMCP, SiP, SSD, and LED dot matrix.


 • DRAM/Flash product packaging testing

• LED dot matrix

• LGA packaging for fingerprint recognition chips

• RAM module assembly






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