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SMT Line

Machine	Brand	Capability
Screen Printer	MPM、FUJI、INOTIS	Min Pad Size：03015(0.3mm*0.15mm)
3D SPI	Parmi、Pemtron、Cyber Optics	Min Pad Size：01005(0.4mm*0.2mm)
SMT Machine	FUJI、Siplace、Panasonic	Min Component Size： 03015 (0.3mm*0.15mm) Flip Chip： (Min solder bump size 68 μm, Min pitch 0.13 mm) μBGA： (Min solder bump size 0.25mm, Min pitch 0.35 mm) IC lead ： (Min pitch 0.24mm)
Reflow Oven	BTU、REHM、ERSA	PCB Size Range：50mm-550mm
AOI	Omron、Jutze、Magic Ray	Min Component Size：01005(0.4mm*0.2mm)
Wave Soldering	ERSA（Wave Soldering、Selective Wave Soldering）	PCB Size Range：50mm-550mm

Armed with advanced SMT equipment and supported by a sophisticated technical tesm, we provide extremely reliable SMT manufacturing services.

• Smallest SMT component: 01005

• Flip chip (minimum solder joint): 68 μm

• μBGA (minimum gap between solder balls): 0.15 mm

• IC lead (minimum width): 0.12 mm

• Maximum PCB dimension: 500 mm × 500 mm

• Minimum PCB dimension: 50 mm × 50 mm

• PCB Maximum thickness: 6mm