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  Standard SMT Production Line


Machine

Brand

specification

Screen Printer

FUJI, MPM, INOTIS

 Minium pad size：3015(0.3mm*0.15mm)

3D SPI

Parmi, Pemtron, CyberOptics

 Minium pad size：01005(0.1mm*0.05mm)

SMT Machine

FUJI, ASM, Panasonic

 Smallest components size： 03015 (0.3mm*0.15mm)
 Flip Chip： (minimum solder joint68 μm ，最小间距 0.13 mm)
 μBGA：      (minimum solder joint0.25mm，最小间距 0.35 mm)
 IC lead ：   (minimum width 0.24mm)

Reflow Oven

Pyramax, Rehm, Ersa

 PCB dimension：50mm-550mm

AOI

PDT, Omron, Jutze

Orbotech, CyberOptics

 Smallest component size：01005(0.1mm*0.05mm)

    Selective Wave Soldering

ERSA

 PCB dimension：50mm-550mm

Armed with advanced SMT equipment and supported by a sophisticated technical tesm, we provide extremely reliable SMT manufacturing services.

• Smallest SMT component: 01005

• Flip chip (minimum solder joint): 68 μm

• μBGA (minimum gap between solder balls): 0.15 mm

• IC lead (minimum width): 0.12 mm

• Maximum PCB dimension: 500 mm × 500 mm

• Minimum PCB dimension: 50 mm × 50 mm

• PCB Maximum thickness: 6mm

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