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December We officially launched our intelligent MSBU production line.
July We acquired shares held by other shareholders in shenzhen Greatwall Kemei Technology Co.,Ltd, an original participating shareholder.
June We entered the semiconductor and IC packing and testing sector with a full acquisition of Payton Technology (Shenzhen) Co., Ltd.
April We fully acquired Shenzhen SED Electronic Product Repairing Co., Ltd.
March We repurchased a 43% equity interest from Shenzhen Kaifa Magnetic Recording Co., Ltd, enabling it to become our wholly-owned subsidiary.
January Our stock name changed from “长城开发” to “深科技.”